SMT

The NXTR is a high-end model placement machine that pursues placement quality and productivity through expanding supported panel sizes and part handling capability and enhancing data processing while continuing the popular Fuji concepts -- compact, high area productivity, single side operation, modular, and simple operation.
The newly developed automatic feeder exchange system frees operators from changeover and supply work.
Fuji is paving the way to the future of Smart Factories with NXTR.

Development concept: 3 Zeros

1.  Zero placement defects

Stable, high-quality placement can be maintained using newly-developed sensing technology to always maintain correct placement through checking the conditions of electronic parts and panels and then reflecting them to the machine.

2.  Zero machine operators

The newly-developed Smart Loader completely automates part supply and changeover for next production according to the production schedule.

This prevents short stops from part supply errors and similar issues that are caused by delays and mistakes during supply work.

3.  Zero machine stops

NXTR continues the complete modularity concept employed by the NXT.

Heads and other units can be exchanged without tools, making it possible to perform maintenance offline.

Predictive maintenance is made possible through self-diagnosis, preventing sudden machine stops from affecting the production plan.

1. Compact lightweight heads

   ●Heads can be exchanged easily

   ●High speed and high accuracy

2. Single-side operation

   ●Only a short distance is traveled for part supply and changeover

   ●Production lines can be configured freely into layouts

3. Checks tombstoned parts, missing parts, and upside-down parts

4. 3D Coplanarity check that removes faulty parts

5. Low impact placement

6. Electrical property checks (LCR checks) of chip parts

7. Panel warpage check

8. High quality, high density placement at top speed

9. Wide range nozzles: Integrate 4 nozzles for multiple parts sizes (0603 (0201"), 1005 (0402"), 1608 (0603"), and 2125 (0805")) into three types (S, M, L)

10. DX head supporting various types of parts

11. 67,200 cph/㎡ - World's best productivity per floor area

12. Bringing specific processes inline

13. Support for placement of various parts: supporting from standard to large and odd-form parts, and by handling parts using various methods such as placing large connectors with pressure insertion or parts with clamp pressure control
    

1. Supports production for large panels and simultaneous production of two models

   ●The AIMEX III can support large panels up to 1,068 (L) x 710 (W) mm in size

   ●Simultaneous production of two different products is possible using a double conveyor configuration machine

2. Handle from 0402 (01005") to 74 x 74 mm sized parts with one head

3. Minimizing the changeover count

   Changeover time can be reduced by performing MFU batch changeover, and by the machine having up to 130 slots for feeders that make it possible to load all of the required parts

4. Ramping up production smoothly

   Automatic data creation and on-machine editing using a large touchscreen panel support ramping up new production and responding quickly to sudden changes to programs
   

5. Easy to introduce, compact design

   AIMEX IIIc is a compact machine, with a width of 1,280 mm and a length of 2,346 mm
   

1.  Hybrid placement of wafers and SMDs

Wafer and reel part placement in a single unit.

Supports tray part and reel part placement as well as direct pickup from wafers.

2.  High accuracy placement

High rigidity construction with linear motor movement and high resolution cameras. Combines the optimum placement pressure, high accuracy, and high quality using advanced control technology.

3.  Supports cleanroom class 1000

With the assumption that this machine is going to be used in cleanrooms, the XY robot is cleanroom capable. By setting a HEPA filter, you can achieve an even better environment for semiconductors.

4.  Easy operation

Equipped with a large 15 inch touchscreen panel and graphical interface. The united interface controls both machine and MWU12i operation.

Covers both wafer map data management and format conversion.